企业信息

TDM COMPACT3

TDM Compact 3: Multi-physical platform for advanced warpage and strain measurements Warpage measurement on µm scale from -65°C to 400°C Warpage measurement with IR independently controlled top/bottom heater banks Reliability testing with convection heater 3D CTE measurement Multiscale analysis Scanning capability for ultra-high resolution of small area

The new TDM Compact 3 has been designed to meet the new challenges for warpage measurements and includes numerous unique features.
The goal was to keep the versatility of the TDM Compact (Modularity, XSFOV, Subroom capability) while offering new options and increase the volume of the chamber to allow measurement of larger batch or larger samples.
The heating properties of the system have been completely redesigned to enhance the capability of the tool.
Two types of heating technology are implemented:
• Reflow simulation: Radiative heating
• Reliability testing: Convection heating cooling
The oven can accommodate samples up to 600 x 420 x 280 mm with a homogeneous heating area surface larger than 300 x 300 mm and a depth of view of 40 mm. Hence measurements of stripes, medium board and 12 inches wafer is possible. Beside larger batch can be characterized. Samples having a surface from 0.5 x 0.5 mm to 300 x 375 mm can be characterized on the same system from -65°C to 400°C.
The scanning module offers the possibility to inspect small are within a large surface. Applications covers the high resolution characterization of units on stripes, wafer or WLP or of package area on PCB board.

Features

IMAGING	Direct sample illumination, non-contact measurement
MAXIMUM SAMPLE SIZE	600 mm x 420 mm x 280mm
FIELD OF VIEW (X,Y)	from 10 x 12 to 300 x 375 mm
DEPTH OF VIEW (Z)	Up to 40 mm
CCD CAMERA RESOLUTION	5 megapixel
ACCURACY	+/-1.5 micron or 3% of measured value, whichever is greater
FOOTPRINT	198 cm x 262 cm x 113 cm

翘曲分析

什么是翘曲分析？

翘曲分析允许测量承受热应力的产品的翘曲和变形。该分析生成 3D 地形剖面。我们的新服务可以在产品生命周期的各个阶段提供帮助，包括研发、过程控制、制造设计、质量控制和故障分析

设备或 PCB 中的热膨胀系数 (CTE) 不匹配会导致回流过程中的变形或正常操作期间的热膨胀，从而导致互连故障。

Insidix的TDM技术

EAG实验室已与 Insidix 提供我们的Compact-3 Sunnyvale，加利福尼亚，设施。该 TDM 工具使用条纹投影技术以非接触式全场采集具有亚微米分辨率的 3D 地形。 TDM 技术使我们的客户能够了解和预测电子设备在回流或产品的整个生命周期等工艺步骤中翘曲变化的可能性。分析样品后，TDM 软件以 3D 绘图、矢量图和 2D 剖面的形式提供直观的结果。 TDM 目前符合以下标准，随着我们继续与客户合作，将添加更多标准：

JEDEC 22B112A

IPC / JEDEC J-STD-020D

MIL-STD-883G

TDM 技术使用相移投影莫尔条纹来提供基于结构光投影的可扩展的高分辨率和快速的全场光学测量。该系统包括双面红外线加热器，可提供三维均匀性和快速升温。

翘曲分析能力

温度剖面上的3D地形测量

亚微米分辨率

温度范围为 -65°C 至 400°C，使用高均匀性 IR 和对流源

从0.5×0.5到400×500 mm的样品具有多尺度FOV

能够测量不连续的表面（例如，PCBA上的多个组件）

温度曲线上的3D测量

http://kenndt.cn.b2b168.com

企业信息

似空科学仪器（上海）有限公司

供应分类

友情链接

INSIDEX热形变与翘曲度测试仪TDM